Sensor semiconductor package, provided with an insert, and...

Details Sensor semiconductor package, provided with an insert, and... Sensor semiconductor package, provided with an insert, and...

2006-08-22

2006-08-22

Geyer, Scott B. (Department: 2812)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257SE23129

Reexamination Certificate

active

07095123

ABSTRACT:
A semiconductor package includes a mounting and electrical connection plate, and a semiconductor component having front and rear surfaces and including a sensor. The rear surface of the semiconductor component is attached to the mounting and electrical connection plate and the front surface is attached to the sensor. An insert is adjacent the front face of the semiconductor component and the sensor and has an access passage for exposing the sensor. A plug is in the access passage of the insert. A body of encapsulation material surrounds the mounting and electrical connection plate, the semiconductor component and the insert.

REFERENCES:
patent: 5534725 (1996-07-01), Hur

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