Sensor packaging using heat staking technique

Chemistry: electrical and wave energy – Apparatus – Electrolytic

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206706, G01N 2726

Patent

active

061530700

ABSTRACT:
An environmental sensor apparatus and method of making same is disclosed in which an environmentally sensitive silicon die is sandwiched between an elastomeric media seal and a conductive elastomeric pad contained within a housing. The conductive elastomeric pad contacts a printed circuit board (PCB) which leads from the housing. The die, elastomers and PCB are secured by a press fit plug which contacts the PCB and is heat staked to the housing to provide a substantially flush hermetic seal.

REFERENCES:
patent: 4449011 (1984-05-01), Kratochvil et al.
patent: 4851104 (1989-07-01), Connery et al.
patent: 5068205 (1991-11-01), Baxter et al.
patent: 5184107 (1993-02-01), Maurer
PCT, International Search Report, European Patent Office, Sep. 08, 1999, PCT/US99/09500.

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