Measuring and testing – Gas analysis – By thermal property
Reexamination Certificate
2007-01-23
2007-01-23
Williams, Hezron (Department: 2856)
Measuring and testing
Gas analysis
By thermal property
Reexamination Certificate
active
10489904
ABSTRACT:
A sensor module having a heating structure and a sensor element is described. The heating structure surrounds the sensor element so that heat dissipation through a frame is largely prevented. This yields a greater measuring accuracy of the sensor module. In particular, interfering influences due to a temperature dissipation through the mount frame are thereby prevented.
REFERENCES:
patent: 4332157 (1982-06-01), Zemel et al.
patent: 4682503 (1987-07-01), Higashi et al.
patent: 4719441 (1988-01-01), Horn
patent: 4885937 (1989-12-01), Tanaka et al.
patent: 4902138 (1990-02-01), Goeldner et al.
patent: 4928513 (1990-05-01), Sugihara et al.
patent: 4944035 (1990-07-01), Aagardl et al.
patent: 4966037 (1990-10-01), Sumner et al.
patent: 5038304 (1991-08-01), Bonne
patent: 5044764 (1991-09-01), Aoki et al.
patent: 5295389 (1994-03-01), Nagata et al.
patent: 5303167 (1994-04-01), Bonne
patent: 5377527 (1995-01-01), Kamiunten
patent: 5464966 (1995-11-01), Gaitan et al.
patent: 5515714 (1996-05-01), Sultan et al.
patent: 5597957 (1997-01-01), Schieferdecker et al.
patent: 5756878 (1998-05-01), Muto et al.
patent: 6290388 (2001-09-01), Saul et al.
patent: 6406181 (2002-06-01), Mueller et al.
patent: 6470742 (2002-10-01), Yamakawa et al.
patent: 6684694 (2004-02-01), Fujiwara et al.
patent: 2002/0121137 (2002-09-01), Fujiwara et al.
patent: 37 11 511 (1988-06-01), None
patent: 3923595 (1990-12-01), None
patent: 196 24 683 (1997-10-01), None
patent: 196 34 690 (1998-02-01), None
patent: 299 07 566 (1999-09-01), None
patent: 199 63 966 (2001-07-01), None
patent: 19963966 (2001-07-01), None
patent: 0 724 151 (1996-07-01), None
patent: 00 70333 (2000-11-01), None
Arndt Michael
Bauer Michael
Simon Isolde
Fitzgerald John
Kenyon & Kenyon LLP
Robert & Bosch GmbH
Williams Hezron
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