Sensor for semiconductor device manufacturing process control

Details Sensor for semiconductor device manufacturing process control Sensor for semiconductor device manufacturing process control

1990-12-31

1994-03-08

McGraw, Vincent P.

Optics: measuring and testing

By polarized light examination

With light attenuation

356 73, 2191216, G01B 1130, G01N 2100, B23K 2600

Patent

active

052932168

ABSTRACT:
A fiber-optic sensor device (210) for semiconductor device manufacturing process control measures polycrystalline film thickness as well as surface roughness and spectral emissivity of semiconductor wafer (124). The device (210) comprises a sensor arm (212) and an opto-electronic interface and measurement box (214), for directing coherent laser energy in the direction of semiconductor wafer (124). Opto-electronic interface/measurement unit (214) includes circuitry for measuring the amounts of laser power coherently reflected in the specular direction from the semiconductor wafer (124) surface, scatter reflected from the semiconductor wafer (124) surface, coherently transmitted in the specular direction through the semiconductor wafer (124), and scatter transmitted through the semiconductor wafer (124). The present invention determines the semiconductor wafer (124) surface roughness and spectral emissivity values using the measured optical powers of incident, specular reflected, scatter reflected, specular transmitted, and scatter transmitted beams.

REFERENCES:
patent: 4364663 (1982-12-01), Gardner et al.
patent: 4874240 (1989-10-01), Watts et al.
patent: 4956538 (1990-09-01), Moslehi
patent: 4991971 (1991-02-01), Geary et al.
Hildebrand et al., "Instrument for Measuring the Roughness of Supersmooth Surfaces", Applied Optics, vol. 13, #1, Jan. 1974.
Clarke et al. "Roughness Measurement with a Laser Scanning Analyser", Wear, vol. 57, #1, Nov. 1979.

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