Sensor die structure

Details Sensor die structure Sensor die structure

2010-03-26

2010-12-28

Warren, Matthew E (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S414000, C257S417000, C257SE29324, C382S115000, C382S124000

Reexamination Certificate

active

07859074

ABSTRACT:
A sensor is implemented in an integrated circuit. The sensor includes one or more sensor pads that are provided at or near a surface of the integrated circuit. One or more integrated circuit components such as a sense amplifier are provided in the integrated circuit die adjacent the sensor pads. One or more other components are provided in the integrated circuit die adjacent the sensor pads.

REFERENCES:
patent: 4577345 (1986-03-01), Abramov
patent: 5789733 (1998-08-01), Jachimowicz et al.
patent: 5940526 (1999-08-01), Setlak et al.
patent: 2001/0025532 (2001-10-01), Kramer
patent: 2005/0110103 (2005-05-01), Setlak
patent: 2005/0213799 (2005-09-01), Sawano

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