Sensor devices with internal packaged coolers

Details Sensor devices with internal packaged coolers Sensor devices with internal packaged coolers

1986-08-01

1990-05-15

Hille, Rolf

357 29, 357 30, 357 72, 357 81, H01L 2356

Patent

active

049262270

ABSTRACT:
Heat sensitive sensors, such as charge coupled devices which must be cooled to reduce dark current leakage, are packaged in a chip carrier and in contact with the cold surface of an electrothermal cooler the warm opposite surface of which contacts the floor of the carrier to heat the carrier body and the window of the chip carrier to prevent fogging of the cover glass while the sensor remains cold.

REFERENCES:
Dr. Adrian March, Improving on Faint Images, Apr. 1986, Sensor Review.

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