Sensor device having a buffer element between the molding...

Details Sensor device having a buffer element between the molding... Sensor device having a buffer element between the molding...

2008-07-29

2008-07-29

Patel, Harshad (Department: 2855)

Measuring and testing

Volume or rate of flow

Thermal type

Reexamination Certificate

active

07404321

ABSTRACT:
A method of manufacturing a sensor device includes a step of forming a sensor chip including a sensing element and a wiring portion connected to the sensing element on a substrate, a step of connecting the wiring portion to a lead, and a step of molding a member for covering a connecting portion between the wiring portion and the lead by injecting a molding material in a mold, while the sensing element is exposed. In the molding step, a buffering member is disposed between an area to be covered with the molded member and the sensing element. Furthermore, in the molding step, the buffering member is deformed by a pressure from the mold, and the molding material is injected in the deformed state of the buffering member so as to form the molded member.

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Office Action dated Feb. 21, 2008 in corresponding German Patent Application No. 10 2006 035 000.6-52 (and English translation).

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