Sensor device and method of producing the same using lead frame

Details Sensor device and method of producing the same using lead frame Sensor device and method of producing the same using lead frame

1998-03-12

2000-03-14

Williams, Hezron

Measuring and testing

Speed, velocity, or acceleration

Structural installation or mounting means

G01P 102

Patent

active

060357126

ABSTRACT:
An acceleration sensor device includes a molded package mounted on a circuit board and first and second leads protruding from the molded package and joined to the circuit board. The molded package retains an island portion of a lead frame in a state where a chip mounting surface of the island portion is perpendicular to the circuit board. An acceleration sensor is mounted on the chip mounting surface of the island portion. After attaching the acceleration sensor chip to the island portion, the island portion is bent up in the lead frame. Then, the island portion, the acceleration sensor chip, and the first and second leads are integrally molded to make the molded package. Accordingly, a detection axis of the acceleration sensor device can be arbitrary set, and the molded package is stably mounted on the circuit board.

REFERENCES:
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patent: 4891984 (1990-01-01), Fujii et al.
patent: 5233871 (1993-08-01), Schwarz et al.
patent: 5389739 (1995-02-01), Mills
patent: 5503016 (1996-04-01), Koen
patent: 5554806 (1996-09-01), Mizuno et al.
patent: 5817941 (1998-10-01), Stalnaker et al.
patent: 5864062 (1999-01-01), Nagahara et al.
Nikkan Kougyou Shinbun: Apr. 17, 1996.
Nikkei Electronics: Jun. 2, 1997.

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