Sensor device

Details Sensor device Sensor device

2007-07-03

2007-07-03

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S792000

Reexamination Certificate

active

11063855

ABSTRACT:
A sensor device includes a circuit chip and a sensor chip. The circuit chip has a bonding portion. The sensor chip is stacked on the bonding portion of the circuit chip. The circuit chip and the sensor chip are bonded by a film-type adhesive containing 91 ±3 weight % of polyimide with no filler.

REFERENCES:
patent: 6542374 (2003-04-01), Muramatsu et al.
patent: 6986933 (2006-01-01), Higashi
patent: 7002257 (2006-02-01), Tao et al.
patent: 2001/0055836 (2001-12-01), Kunda
patent: A-2002-5961 (2002-01-01), None
patent: 10-2000-007325 (2000-02-01), None
patent: 10-2002-65723 (2002-08-01), None
Notice of Preliminary Rejection from Korean Patent Office issued on Apr. 28, 2006 for the corresponding Korean patent application No. 10-2005-0019129 (a copy and English translation thereof).

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