Sensor component with a cavity housing and a sensor chip and...

Details Sensor component with a cavity housing and a sensor chip and... Sensor component with a cavity housing and a sensor chip and...

2007-10-04

2008-12-16

Allen, Andre J (Department: 2855)

Measuring and testing

Fluid pressure gauge

Electrical

C073S706000, C257S678000

Reexamination Certificate

active

07464603

ABSTRACT:
A semiconductor sensor component including a housing with a cavity and a sensor chip and a method for producing the same are described herein. The housing includes an opening to the surroundings of the housing and the sensor chip includes a sensor region which faces the opening. The sensor chip is embedded in the cavity of the housing into a rubber-elastic layer with its rear side and its edge sides, where the rubber-elastic layer includes cleavable included organometallic or inorganic metallic complexes. The metals of the complexes lie in a freely accessible manner on the top side of the rubber-elastic layer and form metallic nuclei for wiring lines which electrically connect the sensor region of the sensor chip to contact pads in the cavity of the cavity housing.

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Nils Heininger et al., “Fertigung von MID Bauteilen vom Rapid Prototyping bis zur Serie mit innovativer LDS-Technologie,” Ricone Symposium, Oct. 1, 2003, Murnau, Germany; XP 002395995.

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