Sensor attachment structure and ultrasonic sensing device

Details Sensor attachment structure and ultrasonic sensing device Sensor attachment structure and ultrasonic sensing device

2006-07-18

2009-02-17

Raevis, Robert R (Department: 2856)

Measuring and testing

Vibration

By mechanical waves

Reexamination Certificate

active

07490517

ABSTRACT:
A sensor attachment structure includes a sound receiving member for receiving an ultrasound, an ultrasonic sensor attached to the sound receiving member. The ultrasonic sensor includes a semiconductor substrate having first and second surfaces opposite to each other and a substrate recess portion recessed from the first surface of the semiconductor substrate so as to form a membrane in the semiconductor substrate. Furthermore, a cap member is located between the sound receiving member and the semiconductor substrate to cover the second surface of the semiconductor substrate. In addition, the cap member has a first surface bonded to the sound receiving member, and a second surface that is bonded to the second surface of the semiconductor substrate at an outer periphery section of the membrane while having a gap between the cap member and the membrane.

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Office Action issued from the German Patent and Trademark Office in corresponding patent application No. 10 2006 035 607.1 dated Jun. 16, 2008.

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