Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent
1997-03-25
1998-10-20
Hardy, David B.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
257666, 257669, 257778, H01L 2348
Patent
active
058250913
ABSTRACT:
An integrated circuit sensor assembly (10) is mounted to a solid surface (11) of a metal leadframe (12) by placing RTV adhesive (30-36) at the four corners of the substrate (14). The RTV material cover less than the entire surface area between the leadframe surface and the substrate. The RTV provides coplanar support for the sensor assembly while maintaining a gap between a significant portion of the surface area between the substrate and the leadframe surface. The metal leadframe undergoes compression and expansion stresses from temperature cycling during the manufacturing process. The gap decouples the sensor assembly from leadframe and provides stress isolation. Moreover, the flexibility and resiliency of the four corner RTV dots absorb stress induced by the leadframe.
REFERENCES:
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patent: 4942383 (1990-07-01), Lam et al.
patent: 5454270 (1995-10-01), Brown et al.
patent: 5465626 (1995-11-01), Brown et al.
patent: 5523628 (1996-06-01), Williams et al.
patent: 5721451 (1998-02-01), Settles et al.
Atkins Robert D.
Hardy David B.
Motorola Inc.
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