Sensor assembly having a thermally insulating enclosure

Details Sensor assembly having a thermally insulating enclosure Sensor assembly having a thermally insulating enclosure

2011-07-19

2011-07-19

Rogers, David A. (Department: 2856)

Measuring and testing

Instrument casing

C073S023310, C073S023320, C073S866500

Reexamination Certificate

active

07980132

ABSTRACT:
A sensor assembly is discussed. The sensor assembly may include a housing. The housing may include an inlet port and an outlet port. The sensor assembly may also include a sensing element disposed within the housing and extending along a longitudinal axis from a first end towards a second end. The sensing element may include heating elements. The sensor assembly may also include a sleeve circumferentially disposed about the sensing element. The sleeve may include a first passageway on a first side of the sensing element and a second passageway on an opposite second side of the sensing element. The first passageway and the second passageway may be longitudinal passageways extending along a length of the sensing element. The sleeve may also include an inlet orifice on one side of the sleeve and an outlet orifice on an opposite side of the sleeve. The inlet orifice may fluidly couple the inlet port with the first passageway and the outlet orifice may fluidly couple the outlet port with the second passageway.

REFERENCES:
patent: 4339318 (1982-07-01), Tanaka et al.
patent: 4802369 (1989-02-01), Morii
patent: 4980042 (1990-12-01), Shiomi et al.
patent: 5505073 (1996-04-01), Gerblinger et al.
patent: 5616825 (1997-04-01), Achey et al.
patent: 5707504 (1998-01-01), Jyouno et al.
patent: 5880353 (1999-03-01), Graser et al.
patent: 6266997 (2001-07-01), Nelson
patent: 6327891 (2001-12-01), Noda et al.
patent: 6347543 (2002-02-01), Geier et al.
patent: 6637256 (2003-10-01), Shirai
patent: 7217355 (2007-05-01), Nair et al.
patent: 7739924 (2010-06-01), Lourdhusamy et al.
patent: 7841769 (2010-11-01), Ma et al.
patent: 2002/0040599 (2002-04-01), Holleboom
patent: 2002/0069698 (2002-06-01), Wagner et al.
patent: 2002/0100312 (2002-08-01), Jackson et al.
patent: 2004/0011645 (2004-01-01), Beckmeyer et al.
patent: 2006/0042946 (2006-03-01), Tsukahara et al.
patent: 2006/0162422 (2006-07-01), Geier et al.
patent: 2007/0089482 (2007-04-01), Uchikawa et al.
patent: 2007/0277605 (2007-12-01), Fouts et al.
patent: 2008/0000667 (2008-01-01), Ruterbusch et al.
patent: 2008/0017510 (2008-01-01), Nair et al.
patent: 2008/0067067 (2008-03-01), Oya et al.
patent: 2008/0282769 (2008-11-01), Nelson
patent: 2009/0056416 (2009-03-01), Nair et al.
patent: 2009/0141769 (2009-06-01), Baldwin
patent: 2009/0211333 (2009-08-01), Lourdhusamy et al.
patent: 2009/0260987 (2009-10-01), Valdes et al.
patent: 2009/0319085 (2009-12-01), Sell et al.
patent: 2010/0158758 (2010-06-01), Gustin
patent: 1445608 (2004-08-01), None

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