Sensor assembly and method of forming the same

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – With auxiliary means to condition stimulus/response signals

Reexamination Certificate

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Details

C324S691000, C324S693000, C340S561000

Reexamination Certificate

active

07352191

ABSTRACT:
A sensor assembly includes a sensing element electrically connected to a conductor of a flexible multiconductor cable using a conductive patch, which is electrically connected to the conductor. A method of forming a sensor assembly includes electrically connecting an electrically conductive patch to a sensing element and electrically connecting a conductor of a multiconductor cable to the electrically conductive patch.

REFERENCES:
patent: 4185162 (1980-01-01), Bogese, II
patent: 4481815 (1984-11-01), Overton
patent: 4862743 (1989-09-01), Seitz
patent: 5000893 (1991-03-01), West et al.
patent: 5010774 (1991-04-01), Kikuo et al.
patent: 5802715 (1998-09-01), O'Neill
patent: 5936412 (1999-08-01), Gershenfeld et al.
patent: 5939190 (1999-08-01), Pfaff et al.
patent: 6116778 (2000-09-01), Faust et al.
patent: 6310407 (2001-10-01), Saito et al.
patent: 6392542 (2002-05-01), Stanley
patent: 6412265 (2002-07-01), Yamamoto et al.
patent: 6424268 (2002-07-01), Isonaga et al.
patent: 6643925 (2003-11-01), Ormachea et al.
patent: 6646452 (2003-11-01), Lester
patent: 6683583 (2004-01-01), Ngin
patent: 6744370 (2004-06-01), Sleichter et al.
patent: 6812898 (2004-11-01), Doub et al.
patent: 6840117 (2005-01-01), Hubbard, Jr.
patent: 6906534 (2005-06-01), Hoisington et al.
patent: 2003/0094959 (2003-05-01), Hoisington et al.
patent: 2003/0158643 (2003-08-01), Murphy et al.
patent: 2004/0043696 (2004-03-01), Suzuki
patent: 2004/0199318 (2004-10-01), Shieh et al.
patent: 2004/0250602 (2004-12-01), Leverrier et al.
patent: 19719455 (1998-11-01), None
patent: 2 488 739 (1982-02-01), None

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