Sensor and method of fabrication

Details Sensor and method of fabrication Sensor and method of fabrication

1996-03-25

1998-08-25

Meier, Stephen

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

H01L 2714, H01L 2982, H01L 2984

Patent

active

057985561

ABSTRACT:
A sensor (10) includes a cavity (31) formed by a substrate (11), an adhesive (21), and a filter (22). A sensing element (14) is located inside the cavity (31) while electrical contacts (17, 18) coupled to the sensing element (14) are located outside the cavity (31). The filter (22) protects the sensing element (14) from physical damage and contamination during die singulation and other assembly processes. The filter (22) also improves the chemical sensitivity, selectivity, response times, and refresh times of the sensing element (14).

REFERENCES:
patent: 4592824 (1986-06-01), Smith et al.
patent: 4671852 (1987-06-01), Pyke
patent: 4768070 (1988-08-01), Takizawa et al.
patent: 4801380 (1989-01-01), Parker et al.
patent: 4874500 (1989-10-01), Madou et al.
patent: 5204690 (1993-04-01), Lorenze, Jr. et al.
patent: 5323051 (1994-06-01), Adams et al.
Patent Abstracts of Japan, vol. 095, 31 Oct. 1995 & JP 07 140103 S (Seiko Epson Corp), 2 Jun. 1995.
Patent Abstracts of Japan, vol. 010, No. 389 (P-531), 26 Dec. 1986 & JP 61 178653 A (Matsuhits Electric Works LTD), 11 Aug. 1986.

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