Sensor

Details Sensor Sensor

2006-05-23

2006-05-23

Dinkins, Anthony (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C174S050510, C174S036000, C174S524000, C174S261000, C174S260000, C174S1170FF, C361S707000, C361S736000, C361S704000, C361S760000, C361S694000, C361S641000, C361S818000, C324S207260, C335S207000, C335S206000, C335S205000

Reexamination Certificate

active

07049510

ABSTRACT:
A sensor with a carrier board which is arranged in a housing is at least partly produced by an injection molding process and fitted with electronic, optical, electromechanical and/or opto-electronic components. A region of the carrier board and at least some of the components disposed thereon are arranged in a hollow space formed inside the at least partly injection molded housing.

REFERENCES:
patent: 4424404 (1984-01-01), Moore et al.
patent: 5201128 (1993-04-01), Olivier et al.
patent: 5319522 (1994-06-01), Mehta
patent: 5554964 (1996-09-01), Jansseune

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