Sensitizing agent for electroless plating and method for sensiti

Details Sensitizing agent for electroless plating and method for sensiti Sensitizing agent for electroless plating and method for sensiti

1985-07-01

1988-03-29

Silverberg, Sam

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

106 111, 427305, C23C 302

Patent

active

047342994

ABSTRACT:
A sensitizing agent for electroless plating which comprises a solution of at least one of palladium (II), silver (I), copper (I), copper (II), and nickel (II) compounds in an amide and a method for sensitizing substrates made of plastics or ceramics which comprises treating the substrates with the sensitizing agent, followed by treating them with a reducing solution, are provided.

REFERENCES:
patent: 3414427 (1968-12-01), Levy
patent: 3963841 (1976-06-01), Anschol

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