Sensitized polyimides and circuit elements thereof

Details Sensitized polyimides and circuit elements thereof Sensitized polyimides and circuit elements thereof

1974-11-11

1976-05-04

Kendall, Ralph S.

Chemistry: electrical and wave energy

Processes and products

204 30, 204 38B, 427 98, 427223, 427225, 427282, 427306, 118 47, 118504, C23C 302

Patent

active

039545709

ABSTRACT:
A process for preparation of an activated or sensitized polyimide polymer, deposition of various catalysts on the sensitized polymer and subsequent plating on said sensitized and catalyzed surface of a metal, e. g., nickel, cobalt, copper, or gold from an electroless bath; improved adhesion, avoidance of blistering, etc. are observed; the process is capable of producing useful printed circuits such as for mounting integrated circuit chips.

REFERENCES:
patent: 3436468 (1969-04-01), Haberecht
patent: 3767538 (1973-10-01), Politycki
patent: 3791848 (1974-02-01), DeAngelo
patent: 3791939 (1974-02-01), Ferrara et al.
patent: 3853587 (1974-12-01), Haskell et al.

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