Geometrical instruments – Gauge – Movable contact probe – per se
Reexamination Certificate
2007-03-06
2007-03-06
Fulton, Christopher W. (Department: 2859)
Geometrical instruments
Gauge
Movable contact probe, per se
C033S558000
Reexamination Certificate
active
11183637
ABSTRACT:
A sensing contact probe includes a beam support and a probe. The probe has a bent beam body that extends from the beam support to a probe tip face that has a position and faces in an angular direction. The bent beam body has first and second beam layers bonded together and have differing residual stresses that bend the beam body. A stress relief region is formed in the bent beam body. The stress relief region has an adjusted stress property that adjusts the bending to control the probe tip face position and angular direction.
REFERENCES:
patent: 4926559 (1990-05-01), Knabel
patent: 5307311 (1994-04-01), Sliwa, Jr.
patent: 5675531 (1997-10-01), McClelland et al.
patent: 5883705 (1999-03-01), Minne et al.
patent: 5953306 (1999-09-01), Yi
patent: 6023103 (2000-02-01), Chang et al.
patent: 6365895 (2002-04-01), Yamamoto
patent: 6392934 (2002-05-01), Saluel et al.
patent: 6477132 (2002-11-01), Azuma et al.
patent: 6597639 (2003-07-01), Hamann et al.
patent: 6651351 (2003-11-01), Christoph et al.
patent: 6692569 (2004-02-01), Roeder et al.
patent: 6708420 (2004-03-01), Flanagan
patent: 6712480 (2004-03-01), Leung et al.
patent: 6720553 (2004-04-01), Bonnell et al.
patent: 6756795 (2004-06-01), Hunt et al.
patent: 6826422 (2004-11-01), Modell et al.
patent: 6851301 (2005-02-01), Kim et al.
patent: 6854648 (2005-02-01), Hong et al.
patent: 6874243 (2005-04-01), Hama et al.
patent: 6983644 (2006-01-01), Yamanaka et al.
patent: 2005/0052984 (2005-03-01), Hong et al.
patent: 2005/0099895 (2005-05-01), Maeda et al.
Zhang et al., “Laser bending for high-precision curvature adjustment of microcantilevers,” Applied Physics Letters 86, 02114 (Jan. 6, 2005).
Sedky et al., “Pulsed-Laser Annealing, a Low-Thermal-Budget Technique for Eliminating Stress Gradient in Poly-SiGe MEMS Structures,” pp. 669-675, Journal of Microelectronmechanical Systems, vol. 13, No. 4, Aug. 2004.
Gage Edward Charles
Hsia Yiao-Tee
Kiely James D.
Peng Wei
Fulton Christopher W.
Seagate Technology LLC
Westman Champlin & Kelly P.A.
LandOfFree
Sensing contact probe does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Sensing contact probe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sensing contact probe will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3753135