Semisolid thermal interface with low flow resistance

Details Semisolid thermal interface with low flow resistance Semisolid thermal interface with low flow resistance

1996-06-14

1999-09-07

Short, Patricia A.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

428617, 428620, 428623, 428626, 428627, 524404, 524430, 524443, 524493, 524496, 524588, 252 75, H01B 302, H01B 346

Patent

active

059500662

ABSTRACT:
An interface material for use in forming a coating interposed along a heat dissipating path between a solid state electronic device and a heat sinking surface. The coating consists of a formulation of a thermally stable wax which is formed as a polyorganosiloxane graft polymer of octadecene and a methylsiloxane host blended with a thermally conductive viscosity stabilizer consisting of a thermally conductive particulate material such as alumina, boron nitride, among others. The graft polymer, with its molecular weight of between approximately 10,000 and 15,000 has a density of between about 0.8 and 0.9 with a melting point of between about 30 degrees C. and 90 degrees C.

REFERENCES:
patent: 3882033 (1975-05-01), Wright
patent: 4265775 (1981-05-01), Aakalu

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