Semiconductors structure precision lapping method and system

Details Semiconductors structure precision lapping method and system Semiconductors structure precision lapping method and system

1992-08-20

1994-03-08

Rose, Robert A.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51262A, 51325, B24B 5302

Patent

active

052916936

ABSTRACT:
An apparatus in the form an N.sub.2 gas gun (30) improves the lapping of a semiconductor device (22) by lapping equipment (10) by an associating a predetermined location (32) on the lapping surface (20) with the semiconductor device (22). Compressed N.sub.2 gas flows through a nozzle device (30) to the predetermined location (32) on the lapping surface (20). Nozzle holder (28) holds the N.sub.2 gas gun (30) in a position for the compressed gas to blow particulate from predetermined location (32) prior to the predetermined location (32) associating with the semiconductor device (22).

REFERENCES:
patent: 2568096 (1951-09-01), Stewart
patent: 3812622 (1974-05-01), Parsons
patent: 3982605 (1976-09-01), Sneckenberger
patent: 4525955 (1985-07-01), Cothrell et al.
patent: 4625460 (1986-12-01), Burgess et al.
patent: 5154021 (1992-10-01), Bombardier et al
Precision VLSI Cross Sectioning and Staining; Mills et al; IEEE/Proc. IRPS; .COPYRGT. 1982 (pp. 214-223).

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