Semiconductor workpiece processing methods

Details Semiconductor workpiece processing methods Semiconductor workpiece processing methods

2006-10-10

2006-10-10

Thomas, David B. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S060000, C451S005000, C451S036000

Reexamination Certificate

active

07118455

ABSTRACT:
Semiconductor processors, sensors, semiconductor processing systems, semiconductor workpiece processing methods, and turbidity monitoring methods are provided. According to one aspect, a semiconductor processor includes a process chamber configured to receive a semiconductor workpiece for processing; a supply connection in fluid communication with the process chamber and configured to a supply slurry to the process chamber; and a sensor configured to monitor the turbidity of the slurry. Another aspect provides a semiconductor workpiece processing method including providing a semiconductor process chamber; supplying slurry to the semiconductor process chamber; and monitoring the turbidity of the slurry using a sensor.

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