Thermal measuring and testing – Temperature measurement – Temperature distribution or profile
Patent
1997-10-03
2000-06-06
Gibson, Randy W.
Thermal measuring and testing
Temperature measurement
Temperature distribution or profile
374141, 374161, G01K 300
Patent
active
060710098
ABSTRACT:
A method and apparatus for measuring the surface temperatures of wire-bonded semiconductors and the like for preparing thermal maps include a conventional ultrasonic wire bonding machine adapted for mounting a fluorescence-decay temperature sensor in the capillary holder. A trigger box circuit is provided to trigger a temperature measurement based on initiation of an electrical voltage signal from the ultrasonic bonding controller. A computer is provided for coordinating the stage control and temperature measurements, and for collating and plotting the temperature, time and location indications as thermal maps and other displayed/printed correlations.
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Gibson Randy W.
Micro)n Technology, Inc.
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