Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent
1993-05-07
1994-09-27
Heinrich, Samuel M.
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
228105, 2281805, H01L 21603
Patent
active
053501063
ABSTRACT:
An improved method for teaching the location of a bond site on a selected lead finger of a semiconductor leadframe during a wire bonding process is provided. Initially, the location of the lateral edges and terminal edge of a tip portion of the lead finger is sensed by an automated vision system of a wire bonding apparatus. A width (W) and a longitudinal axis of the lead finger are then determined. The bond site is located along the longitudinal axis a predetermined distance of (W/2) from the terminal edge of the lead finger. The improved method allows greater accuracy in the placement of bond sites and precisely controls the length of the bond wire used during the wire bonding process.
REFERENCES:
patent: 3894671 (1975-07-01), Kulicke, Jr. et al.
patent: 4441205 (1984-04-01), Berkin et al.
patent: 4671446 (1987-06-01), Sherman
patent: 4813588 (1989-03-01), Srivastava et al.
patent: 4877173 (1989-10-01), Fujimoto et al.
patent: 4886200 (1989-12-01), Tsumura
patent: 4899207 (1990-02-01), Hallowell et al.
patent: 4951120 (1990-08-01), Hagiware et al.
patent: 4978050 (1990-12-01), Amador
patent: 4979663 (1990-12-01), Sofia et al.
patent: 5082165 (1992-01-01), Ishizuka
patent: 5097406 (1992-03-01), Narasimhan et al.
patent: 5111989 (1992-05-01), Holdgrafer et al.
patent: 5119436 (1992-06-01), Holdgrafer
patent: 5137201 (1992-08-01), Yamazaki et al.
patent: 5176311 (1993-01-01), Levine et al.
patent: 5205463 (1993-04-01), Holdgrafer et al.
Surface Mount Technology, "How to Use Integral Vision And Reflow for Placement of Fine SMC's", Spigarelli, Feb. 1987, pp. 31,32.
Gratton Stephen A.
Heinrich Samuel M.
Micron Semiconductor Inc.
LandOfFree
Semiconductor wire bonding method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor wire bonding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wire bonding method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1261226