Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-08-23
2005-08-23
Chaudhuri, Olik (Department: 2824)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S126000, C438S113000
Reexamination Certificate
active
06933172
ABSTRACT:
The invention provides a method for forming spacers very productively. A method for manufacturing a semiconductor wafer includes forming spacers on a plurality of semiconductor chips arranged in a plane on a substrate, respectively. The steps of forming the multiple spacers are conducted collectively on the substrate.
REFERENCES:
patent: 5627108 (1997-05-01), Alibocus et al.
patent: 5736453 (1998-04-01), Kadonishi
patent: 5744827 (1998-04-01), Jeong et al.
patent: 5776799 (1998-07-01), Song et al.
patent: 5904497 (1999-05-01), Akram
patent: 5918113 (1999-06-01), Higashi et al.
patent: 6124152 (2000-09-01), Yim
patent: 6258626 (2001-07-01), Wang et al.
patent: 6294825 (2001-09-01), Bolken et al.
patent: 6333562 (2001-12-01), Lin
patent: 6413797 (2002-07-01), Oka et al.
patent: 6455353 (2002-09-01), Lin
patent: 6458623 (2002-10-01), Goldmann et al.
patent: 6458681 (2002-10-01), DiStefano et al.
patent: 6461893 (2002-10-01), Hyoudo et al.
patent: 6503776 (2003-01-01), Pai et al.
patent: 6506681 (2003-01-01), Grigg et al.
patent: 6569709 (2003-05-01), Derderian
patent: 6593171 (2003-07-01), Farnworth
patent: 6617198 (2003-09-01), Brooks
patent: 6627998 (2003-09-01), Caletka et al.
patent: 6630736 (2003-10-01), Ignaut
patent: 6649444 (2003-11-01), Earnworth et al.
patent: 6710455 (2004-03-01), Goller et al.
patent: 2003/0038355 (2003-02-01), Derderian
patent: 2003/0176018 (2003-09-01), Derderian
patent: 2004/0007782 (2004-01-01), Hedler et al.
Chaudhuri Olik
Luhrs Michael K.
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