Semiconductor wafer wet processing device

Details Semiconductor wafer wet processing device Semiconductor wafer wet processing device

1997-03-26

1999-11-02

Breneman, Bruce

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

134182, B08B 1100

Patent

active

059763116

ABSTRACT:
A semiconductor wafer wet processing device which includes a chamber, a process tank body containing walls and disposed within the chamber, and defining a channel therebetween, at least one of the walls of the process tank body containing a plurality of apertures for providing lateral access between the channel and the interior of the process tank body, a wafer-carrying device disposed within the process tank body, an inlet for introducing a processing liquid into the channel and an outlet for removing the processing liquid from the interior of the process tank body, wherein upon the introduction of the processing liquid through the inlet into the channel, the processing liquid flows over the top of the walls of the process tank body into the interior thereof and laterally through the apertures in the walls of the process tank body for treating the contents thereof and is removed through the outlet.

REFERENCES:
24th Symposium on ULSI Ultra Clean Technology pp. 93-95; Authors: Y. Hiratsuka, N. Fujikawa.

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