Semiconductor wafer treatment

Details Semiconductor wafer treatment Semiconductor wafer treatment

1999-03-05

2000-11-14

Stinson, Frankie L.

Cleaning and liquid contact with solids

Processes

Including regeneration, purification, recovery or separation...

134 254, 1341001, 134110, 134111, 134902, B08B 304

Patent

active

061464686

ABSTRACT:
Method and apparatus for cleaning semiconductor devices and other workpieces using an aqueous rinse solution which is de-oxygenated and hydrogen enriched by passing the aqueous rinse solution and a treatment fluid through an osmotic membrane degasifier. In the preferred embodiment, only a single component, forming gas, is employed to provide both functions of oxygen removal and hydrogen injection.

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Assembly Data Sheet for PALL Separel EFM-530 Degasification Module (undated).
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