Semiconductor wafer testing apparatus and method of testing...

Data processing: measuring – calibrating – or testing – Testing system – Of circuit

Reexamination Certificate

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Reexamination Certificate

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08036848

ABSTRACT:
In a method of testing a semiconductor wafer, semiconductor chips of a predetermined number are selected from among a plurality of semiconductor chips formed on a semiconductor wafer, and a first test is performed on I/O pins of each of the selected semiconductor chips. Then, a second test is performed on a part of the I/O pins of each of non-selected semiconductor chips as ones of the plurality of semiconductor chips other than the selected semiconductor chips.

REFERENCES:
patent: 5534786 (1996-07-01), Kaneko et al.
patent: 6646461 (2003-11-01), Sugiura et al.
patent: 7351597 (2008-04-01), Wada et al.
patent: 2004/0054951 (2004-03-01), Ma et al.
patent: 7-37959 (1995-02-01), None
patent: 2003-332189 (2003-11-01), None
patent: 2004-266017 (2004-09-01), None

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