Semiconductor wafer surface grinding apparatus

Details Semiconductor wafer surface grinding apparatus Semiconductor wafer surface grinding apparatus

1984-11-28

1987-09-15

Schmidt, Frederick R.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51235, B24B 704

Patent

active

046930361

ABSTRACT:
A grinding apparatus comprising a supporting base and at least one grinding wheel assembly disposed to face to the supporting base. The supporting base includes at least one holding table and the surface of the holding table protrudes beyond the surface of the supporting base. The grinding wheel assembly includes a rotatably mounted supporting shaft and a grinding wheel mounted to the supporting shaft. At least the surface layer of the holding table is made of 2MgO.SiO.sub.2 -type ceramics.

REFERENCES:
patent: 3809050 (1974-05-01), Chough et al.
patent: 4183545 (1980-01-01), Daly
patent: 4481738 (1984-11-01), Tabuchi
patent: 4521995 (1985-06-01), Sekiya

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