Coating apparatus – Work holders – or handling devices
Patent
1995-09-20
1997-02-25
Bueker, Richard
Coating apparatus
Work holders, or handling devices
118728, 269289R, 264 81, C23C 1600
Patent
active
056055749
ABSTRACT:
The wafer support apparatus and method provide a plurality of elastic supports having a smooth curvature for contacting a wafer at a respective plurality of support points. Each elastic support directly contacts the wafer at a support point and expands and/or compresses independently of the other elastic supports to accommodate the bending of the wafer during processing.
A wafer support apparatus includes a plurality of flexible elastic supports onto which a wafer is directly positioned, wherein each of the plurality of elastic supports holds the wafer during processing by compressing or expanding in response to bending of the wafer during processing to provide continuous even support for the wafer during processing. A wafer support method includes the steps of providing a plurality of flexible elastic supports and positioning a wafer to be processed directly on the plurality of elastic supports, wherein each of the plurality of elastic supports holds the wafer during processing by compressing or expanding in response to bending of the wafer during processing to provide continuous even support for the wafer during processing.
The elastic supports may be manufactured using a method including the steps of providing a mold in the shape of a wafer elastic support; depositing a layer of an elastic material having low thermal expansion coefficient on the mold; forming a hole in the deposited layer of elastic material at the base of the mold; and burning out the mold.
REFERENCES:
patent: 3084928 (1963-04-01), Opitz
patent: 3712143 (1973-01-01), Weaver
patent: 4138692 (1979-02-01), Meeker
patent: 4530635 (1985-07-01), Engelbrecht
patent: 4540326 (1985-09-01), Southworth
patent: 4557514 (1985-12-01), Cushman
patent: 4944860 (1990-07-01), Bramhall
patent: 5100502 (1992-03-01), Murdoch
patent: 5224406 (1993-07-01), Nasu
patent: 5245736 (1993-09-01), Schertler
patent: 5266119 (1993-11-01), Taniguchi
Okumura Katsuya
Tsunashima Yoshitaka
Bueker Richard
Kabushiki Kaisha Toshiba
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