Semiconductor wafer-securing adhesive tape

Details Semiconductor wafer-securing adhesive tape Semiconductor wafer-securing adhesive tape

1993-08-17

1996-07-23

Ahmad, Nasser

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Polymer derived only from ethylenically unsaturated monomer

428345, 428352, 428353, 428354, 4284763, 4284769, 428519, 428520, 428521, 525 98, 525314, B32B 712

Patent

active

055387713

ABSTRACT:
There is disclosed a semiconductor wafer-securing adhesive tape having a radiation-curable adhesive layer on one surface of a support film, wherein the support film is composed of a laminated film that comprises, as a center layer, a film comprising a styrene/ethylene/butene/styrene block copolymer, a ethylene/acrylic acid-type copolymer, and a polyamide/polyether copolymer in a specific ratio, and has a layer for adhesive coating laid, directly or through a bonding layer, on one surface of the center layer on the side where said radiation-curable adhesive layer is provided, and has a transfer-preventing layer laid, directly or through a bonding layer, on the other surface of the center layer. There is also disclosed a semiconductor wafer-securing adhesive tape wherein the center layer of said semiconductor wafer-securing adhesive tape has a film comprising said SEBS block copolymer or SEPS block copolymer, an amorphous poly .alpha.-olefin, and a polyamide/polyether copolymer, in a specific ratio.

REFERENCES:
patent: 4913960 (1990-04-01), Kuroda et al.
patent: 4999242 (1991-03-01), Ishiwata et al.
patent: 5071686 (1991-12-01), Genske
Derwent Publications Ltd., Abstract 096638 of JP-A-2 215528 (Aug. 1990).
Derwent Publications, Ltd., Abstract 032543 of JP-A-1 309 206 (Dec. 1989).

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