Semiconductor wafer sectioning machine

Details Semiconductor wafer sectioning machine Semiconductor wafer sectioning machine

1982-09-13

1985-01-29

Smith, James G.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51217R, B24B 536

Patent

active

044957327

ABSTRACT:
A wafer holding chuck for a wafer sectioning machine is provided with a substantially flat chuck plate having an extremely flat resilient strip support for supporting only a very small area of the wafer above the surface of the chuck plate at a point opposite the rotating abrasive tool. The pressure of the highly accurate rotating abrasive tool engages the front surface of the wafer to be sectioned and the resilient strip support conforms to the rear surface of the wafer causing the abrasive tool to make uniform contact with the front surface of the wafer being sectioned so that the section cut in the wafer is extremely uniform.

REFERENCES:
patent: 2165002 (1939-07-01), Ocenasek
patent: 3052461 (1962-09-01), Bateman
patent: 3745716 (1973-07-01), Turner
patent: 4056136 (1977-11-01), Miller
patent: 4306731 (1981-12-01), Shaw

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