Semiconductor wafer sawing system and method

Details Semiconductor wafer sawing system and method Semiconductor wafer sawing system and method

2011-05-17

2011-05-17

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S033000, C438S068000, C438S462000

Reexamination Certificate

active

07943425

ABSTRACT:
Semiconductor wafer sawing systems and methods are described in which a wafer may be secured in a sawing position having a surface exposed to incur sawing with at least a portion of the exposed wafer surface positioned below the center of gravity of the wafer such that prevailing force of gravity may be used to assist in the removal of contaminants from the wafer.

REFERENCES:
patent: 6776078 (2004-08-01), Gawazawa

Affiliated with

Also associated with

Rating

Semiconductor wafer sawing system and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor wafer sawing system and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wafer sawing system and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2660757