Semiconductor wafer regenerating system and method

Details Semiconductor wafer regenerating system and method Semiconductor wafer regenerating system and method

2007-08-28

2007-08-28

Rose, Robert A. (Department: 3723)

Abrading

Abrading process

Utilizing fluent abradant

C451S081000

Reexamination Certificate

active

11380850

ABSTRACT:
A semiconductor wafer regenerating system is capable of easily and efficiently removing fabricating patterns formed on a semiconductor wafer to enable reuse of the semiconductor wafer. The system, which removes patterns of the semiconductor wafer in a dry manner by using blasting grit, includes a mesh conveyor, a grit blaster, a swinging element, a collecting element, a separating element, and a dust collector. The mesh conveyor transports the semiconductor wafer so that the patterns face upward. The grit blaster is installed above the mesh conveyor and has at least one blasting nozzle for blasting grits toward the semiconductor wafer to remove the patterns from the semiconductor wafer. The swinging element swings the blasting nozzle in a plane perpendicular to a transporting path of the semiconductor wafer along the mesh conveyor. The collecting element underneath the mesh conveyor collects pulverulent bodies including grits, chips, and dusts falling from the mesh conveyor. The separating element is connected to the collecting element to separate the grits and chips from the dusts. The dust collector is connected to the separating element to collect the dusts separated by the separating element.

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