Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having a perfecting coating
Reexamination Certificate
2005-02-01
2005-02-01
Picardat, Kevin M. (Department: 2822)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
Having a perfecting coating
C438S458000, C438S460000, C438S464000
Reexamination Certificate
active
06849524
ABSTRACT:
A method of protecting and cleaning a semiconductor wafer using laser ablation includes the following steps: applies a protective coating on the side to be cut of a wafer with sapphire substrate, mounts the other side of the sapphire wafer on an adhesive tape, mounts the sapphire wafer on a cutting table, cuts the sapphire wafer with a laser, breaks the sapphire wafer into die, and cleans the sapphire wafer with a cleaning solution that removes slag resulting from the cutting, debris resulting from the breaking, and the protective coating, but the adhesive tape, the cleaning solution, and the protective coating are selected such that the cleaning solution does not damage the adhesive tape.
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Eliashevich Ivan
Gottfried Mark
Schwed Stephen
Shelton Bryan S.
Emcore Corporation
Gibbons, Del Dio, Dolan, Griffinger & Vecchione
Picardat Kevin M.
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