Semiconductor wafer processing system

Details Semiconductor wafer processing system Semiconductor wafer processing system

1989-05-09

1993-09-21

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156626, 156363, 156510, 1563796, 1983471, 198364, 198365, 118686, 118 35, H01L 2100

Patent

active

052465241

ABSTRACT:
A semiconductor wafer processing system having a plurality of processing devices forming a base processing line for processing in sequence a workpiece having a semiconductor wafer is provided with an auxiliary loader connected to one of the processing devices for supplying the workpiece forming a processing line different from the base processing line, and an auxiliary unloader connected to the one processing device for receiving the workpiece processed by the one processing device at times when the one processing device is not supplied the workpiece by the processing device upstream of the one processing device in the base processing line.

REFERENCES:
patent: 1908487 (1933-05-01), Powers
patent: 3401068 (1968-09-01), Benton
patent: 3522942 (1970-08-01), Hepp
patent: 3620879 (1971-11-01), Imamura et al.
patent: 3756898 (1973-09-01), Frantzen et al.
patent: 4013498 (1977-03-01), Frantzen et al.
patent: 4017343 (1977-04-01), Haas
patent: 4772357 (1988-09-01), Carlson et al.
patent: 4792033 (1988-12-01), Iwata et al.
patent: 4895107 (1990-01-01), Yano et al.

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