Semiconductor wafer processing method

Details Semiconductor wafer processing method Semiconductor wafer processing method

2008-07-25

2009-06-23

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S691000, C438S659000

Reexamination Certificate

active

07550387

ABSTRACT:
A semiconductor wafer processing method for planarizing an additional layer formed on the front side of a semiconductor wafer. First, the wafer is held on a chuck table included in a cutting device in the condition where the additional layer is exposed, and a table base supporting the chuck table is moved toward a working position. In concert with the movement of the table base, the exposed surface of the additional layer is cut by a bit of a cutting tool rotationally driven by a spindle motor. Thereafter, the exposed surface of the additional layer is polished by a polishing device to planarize the exposed surface of the additional layer.

REFERENCES:
patent: A 9-82616 (1997-03-01), None
patent: WO 2004/053967 (2004-06-01), None

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