Semiconductor wafer processing adhesives and tapes

Details Semiconductor wafer processing adhesives and tapes Semiconductor wafer processing adhesives and tapes

1997-06-03

1998-12-22

Zirker, Daniel

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428343, 428356, 525 89, B32B 712

Patent

active

058516646

ABSTRACT:
A semiconductor wafer processing tape comprises a permanent backing and a layer of a non-pressure sensitive adhesive comprising a thermoplastic elastomer block copolymer on the permanent backing. Optionally, the adhesive may include an adhesion modifier such as a tackifying resin, a liquid rubber or a photocrosslinking agent. The tapes are useful for both wafer grinding and wafer dicing applications. A method of processing semiconductor wafers is disclosed.

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