Semiconductor wafer polishing using a hydrostatic medium

Details Semiconductor wafer polishing using a hydrostatic medium Semiconductor wafer polishing using a hydrostatic medium

1991-10-29

1993-03-16

Kisliuk, Bruce M.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51283R, 511311, 511312, 511314, 51236, B24B 710, B24B 722

Patent

active

051933160

ABSTRACT:
A method and apparatus for polishing semiconductor wafers in which a force applied to the wafer is uniformly distributed across a surface of the wafer during polishing using a hydrostatic or compliant material situated between the wafer and a piston. In a preferred embodiment, the hydrostatic or compliant material is an elastic solid or fluid filled bag. One or more teflon disks or teflon coated surfaces may be included between the hydrostatic or compliant material and a second compliant layer to form a bearing to allow the wafer to rotate about its central axis during polishing.

REFERENCES:
patent: 3841031 (1974-10-01), Walsh
patent: 3898770 (1975-08-01), Benz et al.
patent: 4270316 (1981-06-01), Kramer et al.
patent: 4512113 (1985-04-01), Budinger
patent: 4519168 (1985-05-01), Cesna
patent: 4897966 (1990-02-01), Takahashi
patent: 4944119 (1990-07-01), Gill, Jr. et al.

Affiliated with

Also associated with

Rating

Semiconductor wafer polishing using a hydrostatic medium does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor wafer polishing using a hydrostatic medium, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wafer polishing using a hydrostatic medium will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-344692