Abrading – Machine – Rotary tool
Patent
1998-06-03
2000-07-18
Eley, Timothy V.
Abrading
Machine
Rotary tool
451398, B24B 2900
Patent
active
060899603
ABSTRACT:
A wafer polishing machine uses a pedestal unit that holds a semiconductor wafer using a vacuum force for polishing the surface of the wafer on a polishing pad and slurry mixture. A gimbal mechanism is implemented within the pedestal unit so that the various portions of the wafer surface are evenly polished. The gimbal mechanism enables the portion of the pedestal unit holding the semiconductor wafer to precess relative to that portion of the pedestal unit connected to the polishing machine. An elastomeric shim ring is also used within the pedestal unit to provide further compliance of the wafer surface to the various contours of the polishing pad during the polishing process.
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Eley Timothy V.
Kordzik Kelly K.
Nguyen Dung Van
One Source Manufacturing
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