Abrading – Abrading process – Glass or stone abrading
Patent
1996-11-26
1998-02-10
Morgan, Eileen P.
Abrading
Abrading process
Glass or stone abrading
451285, 451287, B24C 4700
Patent
active
057162581
ABSTRACT:
A semiconductor wafer polishing machine and method are described in which a motor driven rotating spindle is coupled to the wafer carrier by a flexible coupling element. The carrier is releasably attached to a load transfer plate by a vacuum pressure chamber to enable removal of the carrier for loading and unloading of wafers prior to and after polishing. The motor and spindle together with the load transfer plate and carrier are moved between and raised rest position and a lowered polish position by a positioning cylinder. A load pressure bellows applies a polishing load force to the load transfer plate through an air lubricated thrust bearing to urge the wafers on the carrier against a rotating polishing table for polishing the wafers. The air bearing isolates the load force of the bellows from the rotational force of the spindle and allows sliding movement of the load plate relative to the bellows. The carrier, load transfer plate and the polishing table may all be made of rigid foam material, such as metal or ceramic, in order to reduce the mass and weight of these elements while providing them with a strong rigid construction.
REFERENCES:
patent: 3603042 (1971-09-01), Boettcher
patent: 3731435 (1973-05-01), Boettcher et al.
patent: 3747282 (1973-07-01), Katzke
patent: 4009539 (1977-03-01), Day
patent: 4193226 (1980-03-01), Gill, JR. et al.
patent: 4194324 (1980-03-01), Bonora et al.
patent: 4270316 (1981-06-01), Kramer et al.
patent: 4316757 (1982-02-01), Walsh
patent: 4450652 (1984-05-01), Walsh
patent: 4512113 (1985-04-01), Budinger
patent: 4519168 (1985-05-01), Cesna
patent: 4680893 (1987-07-01), Cronkhite et al.
patent: 4918870 (1990-04-01), Torbert et al.
patent: 5081795 (1992-01-01), Tanaka et al.
patent: 5135349 (1992-08-01), Lorenz et al.
patent: 5142173 (1992-08-01), Konno et al.
patent: 5153841 (1992-10-01), Goff et al.
patent: 5205082 (1993-04-01), Shendon et al.
patent: 5238354 (1993-08-01), Volovich
patent: 5423716 (1995-06-01), Strasbaugh
patent: 5443416 (1995-08-01), Volodarsky et al.
patent: 5476414 (1995-12-01), Hirose et al.
patent: 5527209 (1996-06-01), Volodarsky et al.
patent: 5593341 (1997-01-01), Thibaut
LandOfFree
Semiconductor wafer polishing machine and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor wafer polishing machine and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wafer polishing machine and method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2072905