Semiconductor wafer polishing machine

Details Semiconductor wafer polishing machine Semiconductor wafer polishing machine

1997-06-30

1999-03-02

Scherbel, David A.

Abrading

Machine

Rotary tool

451288, 451289, B24B 500, B24B 2900

Patent

active

058762728

ABSTRACT:
A wafer mount plate is inserted loosely into a housing, and the wafer mount plate is supported in such a manner as to be swingable and movable vertically and horizontally with respect to a polishing pad. An air chamber is formed between the wafer mount plate and the housing. By controlling the internal pressure of the air chamber, it is possible to control polishing pressure applied on the wafer mount plate. Since the entire top side of the wafer mount plate can be uniformly pressured, the uniform polishing pressure can be applied on the entire surface of the semiconductor wafer. Further, the wafer mount plate inclines in accordance with variations in the inclination of the polishing pad so that the semiconductor wafer and the polishing pad can be maintained in a parallel position.

REFERENCES:
patent: 5081795 (1992-01-01), Tanaka et al.
patent: 5584746 (1996-12-01), Tanaka et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5588902 (1996-12-01), Tominaga et al.
patent: 5643048 (1997-07-01), Iyer
patent: 5643053 (1997-07-01), Shendon
patent: 5645473 (1997-07-01), Togawa et al.
patent: 5651724 (1997-07-01), Kimura et al.
patent: 5653624 (1997-08-01), Ishikawa et al.
patent: 5670011 (1997-09-01), Togawa et al.

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