Semiconductor wafer polishing appartus and method

Details Semiconductor wafer polishing appartus and method Semiconductor wafer polishing appartus and method

1994-05-13

1997-02-25

Rachuba, Maurina T.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 11, 451 41, 451 53, 451 54, 451 56, 451289, B24B 4900

Patent

active

056054874

ABSTRACT:
Apparatus for polishing semiconductor wafers comprises a housing, a mounting apparatus within the housing for wax mounting a first face of a semiconductor wafer to a first face of a polishing block, and a first semiconductor wafer polisher within the housing for polishing a second face of the semiconductor wafer. The second face of the semiconductor wafer is opposite the first face of the semiconductor wafer. A first transfer mechanism is within the housing for delivering the polishing block and semiconductor wafer from the mounting apparatus to adjacent the first semiconductor wafer polisher. A controller controls operation of the mounting apparatus, the first semiconductor wafer polisher, and the first transfer mechanism.

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Written description of an MEMC automated polishing line first operated in 1980.
"Method of Mounting Wafers" Western Electric Technical digest No. 44, Oct. 1976.

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