Semiconductor wafer polishing apparatus

Details Semiconductor wafer polishing apparatus Semiconductor wafer polishing apparatus

1997-01-29

1998-04-14

Morgan, Eileen

Abrading

Machine

Rotary tool

451285, 451288, 451 41, B24B 722

Patent

active

057385734

ABSTRACT:
Semiconductor wafer polishing apparatus, in accordance with the princples of this invention, includes an annular-shaped platen rotatable about a non-rotating center core having a diameter smaller than the width of the annular-shaped platen. The center core is the source of slurry which permits convenient dispensing of slurry. The apparatus includes a bridge which extends from the center core to the rigid table in which the apparatus is housed. The bridge is a convenient support for apparatus for pad rejuvenation and for sensing and correcting wafer attitude and characteristics as well as slurry properties on a real time basis for improving wafer uniformity and local surface planarity.

REFERENCES:
patent: 5582534 (1996-12-01), Shendon et al.
patent: 5597346 (1997-01-01), Hempel, Jr.
patent: 5643053 (1997-07-01), Shendon
patent: 5647789 (1997-07-01), Kitta et al.
patent: 5653622 (1997-08-01), Drill et al.

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