Semiconductor wafer pod

Details Semiconductor wafer pod Semiconductor wafer pod

2005-04-26

2005-04-26

Pert, Evan (Department: 2829)

Semiconductor device manufacturing: process

With measuring or testing

C414S259000, C269S288000

Reexamination Certificate

active

06884639

ABSTRACT:
A semiconductor wafer pod includes a measurement sensor configured within a housing. The sensor faces towards a surface of a wafer being accommodated in the pod. The pod can be connected to the conventional load-port of a semiconductor wafer manufacturing tool. Thereby, measurement data can be collected immediately after wafer processing without a need to transport the wafer. The invention enables the cost-effective development of tool-integrated metrology.

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patent: 5905302 (1999-05-01), Lane et al.
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patent: 6082951 (2000-07-01), Nering et al.
patent: 6164894 (2000-12-01), Cheng
patent: 20020118365 (2002-08-01), Kessel et al.
patent: WO 9859229 (1998-12-01), None
patent: WO 9949502 (1999-09-01), None

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