Semiconductor wafer mounting and cutting system

Details Semiconductor wafer mounting and cutting system Semiconductor wafer mounting and cutting system

1985-10-25

1987-09-29

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

156 64, 156257, 156353, 156523, 225 93, 437 8, 437209, B32B 3118

Patent

active

046967125

ABSTRACT:
A semiconductor wafer mounting and cutting system including a wafer mounting machine for mounting a semiconductor wafer to a frame and a wafer cutting machine for receiving the frame and the wafer mounted thereto fed from the wafer mounting machine and cutting the wafer as required. The system further includes a controlling device for forming a relative relation signal showing a relative relation between a first indication which has been or is applied to the frame and a second indication of the wafer, which wafer has been or is mounted to the frame, and memory means for memorizing the relative relation signal formed by the controlling device.

REFERENCES:
patent: 3811182 (1974-05-01), Ryan et al.
patent: 4296542 (1981-10-01), Gotman
patent: 4485553 (1984-12-01), Christian et al.

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