Semiconductor wafer mount apparatus

Details Semiconductor wafer mount apparatus Semiconductor wafer mount apparatus

2011-03-01

2011-03-01

Koch, III, George R (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With testing, measuring, and/or indicating means

C156S510000, C156S515000, C156S583200

Reexamination Certificate

active

07896047

ABSTRACT:
A grinding unit grinds an annular convex portion formed at an outer periphery of a back face of a wafer such that the wafer has a uniform thickness. After such process, a robot arm of a transport unit transports the wafer to an inspection unit for inspecting occurrence of damage at the wafer. Then, the robot arm transports the wafer without damage to a mount frame preparation unit. Herein, the wafer is joined to a ring frame through a dicing tape, and then a protective tape is separated from a front face of the wafer. Thus, a mount frame is prepared.

REFERENCES:
patent: 7078262 (2006-07-01), Yamamoto et al.
patent: 2002/0173229 (2002-11-01), Kobayashi
patent: 2004/0097054 (2004-05-01), Abe
patent: 2005/0101103 (2005-05-01), Yamamoto
patent: 2006/0068524 (2006-03-01), Yamamoto
patent: 1422791 (2003-06-01), None
patent: 2002-299196 (2002-10-01), None
patent: 2002-343766 (2002-11-01), None
patent: 2006-108127 (2006-04-01), None
The First Office Action for Application No. 2007101437097 from The State Intellectual Property Office of the People's Republic of China dated Dec. 25, 2009.

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