Semiconductor wafer marking for identification during processing

Details Semiconductor wafer marking for identification during processing Semiconductor wafer marking for identification during processing

1990-10-16

1992-12-29

Couso, Jose

Image analysis

Histogram processing

For setting a threshold

382 11, 382 61, 235456, G06K 900

Patent

active

051757745

ABSTRACT:
A semiconductor wafer (50) is inscribed by a laser scribe system with a numeric wafer identifying number in binary dot-array encoded form to facilitate machine readability. A matrix (20) of predetermined dot locations on the wafer defines a series of parallel columns (e.g. 28) of dot locations, each column corresponding to a respective digit of the ID number. In each column, a number of dots equal to the numeric value of the corresponding digit plus one (N+1) is marked in a contiguous series starting from a baseline row (27,39) of the matrix. A pair of dot arrays (20,30) thus formed are aligned for convenient validity checking. The wafer area required for a dot-array encoded ID number is less than the area required to write a single digit of the ID number in alphanumeric form (14).

REFERENCES:
patent: 3470357 (1969-09-01), Ritzerfeld
patent: 3544771 (1970-12-01), O'Meara
patent: 3776454 (1973-12-01), Jones
patent: 4162035 (1979-07-01), Calzetta
patent: 4275380 (1981-06-01), Gardner et al.
patent: 4409686 (1983-10-01), Ports et al.

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