Semiconductor wafer manufacturing method and wafer

Details Semiconductor wafer manufacturing method and wafer Semiconductor wafer manufacturing method and wafer

2007-07-31

2007-07-31

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S928000

Reexamination Certificate

active

10512637

ABSTRACT:
The present invention provides a method for manufacturing a semiconductor wafer capable of manufacturing a wafer without ring-like sag in an outer peripheral portion thereof when polishing an alkali etched wafer, and a wafer without the ring-like sag in an outer peripheral portion thereof. The present invention comprises: a back surface part polishing and edge polishing step for performing back surface part polishing and edge polishing such that mirror polishing is performed on a chamfered portion and an inner part extending inward from a boundary between the chamfered portion and a back surface of a starting wafer; and a front surface polishing step for mirror polishing a front surface of the wafer subjected to the back surface part polishing and edge polishing step holding the wafer by the back surface thereof.

REFERENCES:
patent: 5821166 (1998-10-01), Hajime et al.
patent: 6376378 (2002-04-01), Chen et al.
patent: 6530826 (2003-03-01), Wenski et al.
patent: 6566267 (2003-05-01), Wenski
patent: 2001/0014570 (2001-08-01), Wenski et al.
patent: 2001/0039119 (2001-11-01), Kishimoto
patent: 2002/0037650 (2002-03-01), Kishimoto
patent: 2002/0077039 (2002-06-01), Wenski et al.
patent: 2003/0008478 (2003-01-01), Abe et al.
patent: 2003/0060050 (2003-03-01), Pietsch et al.
patent: 2003/0068891 (2003-04-01), Bang et al.
patent: 2003/0109139 (2003-06-01), Wenski et al.
patent: 2003/0171075 (2003-09-01), Nihonmatsu et al.
patent: 2004/0043616 (2004-03-01), Harrison et al.
patent: 2004/0108297 (2004-06-01), Erk et al.
patent: 2004/0195657 (2004-10-01), Miyashita et al.
patent: 2005/0255610 (2005-11-01), Sato et al.
patent: 1 189 266 (2002-03-01), None
patent: 1 313 135 (2003-05-01), None
patent: 11-188590 (1999-07-01), None
patent: 11-207583 (1999-08-01), None
patent: 2000-243731 (2000-09-01), None
International Search Report for PCT/JP03/05259 mailed on Jul. 22, 2003.
Supplementary European Search Report, Reference EP32833TS900dfi (dated Dec. 14, 2006).

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