Metal working – Barrier layer or semiconductor device making
Patent
1991-05-22
1992-10-20
Chaudhuri, Olik
Metal working
Barrier layer or semiconductor device making
118500, 483 14, H01L 2168
Patent
active
051558882
ABSTRACT:
A wafer lifting apparatus is comprised of guide rails (10) that are disposed on a supporting surface (22). A lifting apparatus (24) is disposed on the surface (22), having an inclined surface (26). Grooves (28) are disposed on the inclined surface and spaced apart a distance equal to that of wafers (20) in a wafer handling boat (16). The wafer handling boat (16) has the end pieces (12) and (14) urged downward into the guide rails (10) until the lowermost peripheral edges of the wafers (20) contact the grooves (28) in the inclined surface (26). When fully lowered, the rearmost ones of the wafers (20) are completely lifted out of the boat such that they are supported entirely by the grooves (28). In this manner, they can be viewed from the end of the wafer lifting apparatus. A flat finding device in the form of a flat finding cylinder (44) is also provided in an opening (38) on a supporting surface (36) for holding the boat (16). The wafer handling cylinder (44) is operated to find the flat (32) on the wafer (20) and then a platform (54) urged upward from underneath the surface (36) to urge the wafers (20) upward on combs (68) and (70), that are also disposed at an inclined angle.
Chaudhuri Olik
Griffis Andrew
Mactronix
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